In-situ testing and heterogeneity of UFG Cu at elevated temperatures

Purpose: The motivation of present investigation is the study of deformation-induced processes during in-situ tensile and compression test at elevated temperature in order to elucidate the role of the microstructure changes during creep testing. Design/methodology/approach: Experiments were conducted to investigate deformation-induced processes during in-situ tensile test at elevated temperature. Findings: It was found that creep resistance of UFG pure Al and Cu is considerably improved after one ECAP pass in comparison with coarse grained material, however, further repetitive pressing leads to a noticeable deterioration in creep properties of ECAP material. Researches limitations/implications: In the present work was found that ultrafine-grained microstructure is instable and significant grain growth has already occurred during heating to the testing temperature. Originality/value: The experiments conducted on pure Al and Cu found that their creep resistance is considerably improved after one ECAP pass in comparison with unpressed material.