Electrochemical synthesis and structural properties of Cu/Ni multilayers

Multilayers of Cu/Ni were electodeposited on monocrystalline Si (100) and polycrystalline copper foil substrates using a single bath containing nickel sulphamate, copper sulphate and boric acid. Voltammetric studies allow establishing the suitable potentials for Cu pure and Ni rich single layer. Based on these studies lower activity of silicon than cooper substrate was stated. SEM investigations confirm periodical structure of the prepared multilayers when the Λ period exceeds 50 nm. For lower bilayer thickness XRD method allowed determining Λ value after precise establishing diffraction lines S±i and ML. XRD investigations show that all deposited multilayers exhibited [100] texturing.