Research on the process of superfinishing ceramic surfaces of cutting plates

This paper presents initial research on the surfaces of cutting ceramic plates ground using diamond grinding wheels. Ceramic materials were ground using a piezoelectric feed-in system whose aim was to minimize the effect of brittle cracking of the ceramic material in the machining zone. Due to precise machining it is possible to smooth out the machined surface by ductile-regime grinding the material removal mechanism and, in consequence, reducing the defects on its surface and in the surface layer of the ground material.