Thin and Rectangular Die Bond Pick-Up Mechanism to Reduce Cracking During the Integrated Circuit Assembly Process

The demand for small, thin, and lightweight electronic devices is increasing. More advanced design and assembly processes of electronic packaging technology have developed to fulfill this need. The critical processes in semiconductor packaging involved in meeting the ever increasing demands of technology include wafer back grinding, dicing, and die attachment. With low die thickness, the risk of die failure, which can cause functional damage, is high. In the die attachment process, the pin ejector causes an impact during the pick and place process. Those effects can result in a micro indentation or micro crack under the die and would be the weak point throughout the entire process. This study designed and evaluated an ejector system for the die attachment process. The proposed method uses a static pole heated inside the cavity for the platform to die before being ejected. Vacuum stabilizes the die suction. Moreover, heat softens the sawing tape and weakens the die adhesion. For die selection during the die attachment process, the results show that the critical die crack problem for a thin and rectangular die is solved using the proposed method. In summary, the packaging of semiconductors has advanced to accommodate the pick-up technology solution in relation to the challenging material needed for the current miniaturization market trend and demand.

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Opracowanie rekordu ze środków MNiSW, umowa Nr 461252 w ramach programu "Społeczna odpowiedzialność nauki" - moduł: Popularyzacja nauki i promocja sportu (2020).