The effect of oscillatory compression test on the Cu microstructure form.

Transmission electron microscopy (TEM) investigations of dislocation microstructure have been performed on polycrystalline Cu subjected to the oscillatory compression test and the compression test. The aim of this work is to reveal how the complexity of mode deformation realized by the oscillatory compression method influences on the means dislocation microstructure form. It was shown that the oscillatory compression method leads to the process of strain localization on the microscopic level.