Microstructure Transition in Electroplated CU Films at Room Temperature - I. Electrical Resistivity and XRD Analysis

A suite of systematic experimental studies on electroplated copper films was carried out by a systematic change of plating current density and additive concentration in the plating electrolyte. The films were characterized by employing resistivity measurement and x-ray diffraction. In the indicated range, the annealing time decreased with increasing plating current density, and showed a minimum as a function of additive concentration. Electroplated copper films had strong (111) texture which further increased during self-annealing.