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Tytuł pozycji:

Numerical simulation of solidification process for biological colloids

Tytuł:
Numerical simulation of solidification process for biological colloids
Autorzy:
Pawłowski, Michał
Kopernik, Magdalena
Więcek-Chmielarz, Justyna
Major, Roman
Współwytwórcy:
Więcek-Chmielarz, Justyna
Data publikacji:
2025-07-16
Wydawca:
RepOD
Tematy:
Engineering
numerical simulation
Dostawca treści:
Repozytorium Otwartych Danych
Inne
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Simulation Summary

This file contains the results of transient simulations for copper inserts positioned at angles of 0° and 15°. The latest version of Ansys Fluent 2023 R2 was used throughout the study. The finite volume mesh was generated using Ansys Fluent Meshing with the following configuration:

Mesh Generation Parameters:

  • Local Sizing: No
  • Surface Mesh:
  • Use Custom Size Field: No
  • Minimum Size: 0.01953125 mm
  • Maximum Size: 0.5 mm
  • Growth Rate: 1.2
  • Size Functions: Curvature & Proximity
  • Curvature Normal Angle: 18°
  • Cells Per Gap: 1
  • Scope Proximity To: Edges
  • Draw Size Boxes: Yes
  • Separate Out Boundary Zones by Angle: No
  • Create Regions:
  • Estimated Number of Fluid Regions: 2
  • Add Boundary Layers:
  • Enabled: Yes
  • Offset Method Type: Smooth-transition
  • Number of Layers: 3
  • Transition Ratio: 0.272
  • Growth Rate: 1.2
  • Apply To: Fluid regions
  • Grow On: Only walls
  • Volume Mesh Generation:
  • Solver: Fluent
  • Fill With: Polyhedra
  • Mesh Fluid Regions: Yes
  • Mesh Solid Regions: Yes
  • Sizing Method: Global
  • Growth Rate: 1.2
  • Max Cell Length: 0.6640875 mm
  • Enable Parallel Meshing: Yes

Simulation Setup:

  • Solver Settings:
  • Type: Pressure-Based
  • Velocity Formulation: Absolute
  • Time: Transient
  • Gravity: Enabled (Y = 9.81 m/s²)
  • Models Enabled:
  • Energy
  • Solidification and Melting
  • Viscous: Laminar

Materials Used:

From the Ansys material database:

  • Water
  • Copper (wire)
  • Air

Custom material:

  • Polystyrene
  • Density: 1050 kg/m³
  • Specific Heat Capacity (Cp): 1100 J/kg·K
  • Thermal Conductivity: 0.12 W/m·K

Boundary Conditions:

  • Air region temperatures:
  • Variant 1: -22°C
  • Variant 2: -80°C

Solution Methods:

  • Gradient: Least Squares Cell Based
  • Pressure: Second Order
  • Momentum: Second Order Upwind
  • Energy: Second Order Upwind
  • Pseudo Time Method: Off
  • Transient Formulation: Second Order Implicit
  • Warped-Face Gradient Correction: Enabled

Initialization:

  • Initial domain temperature: 22°C
  • Copper insert temperature: -80°C
  • Time step: 0.0001 s
  • Number of time steps: Dependent on full solidification of fluid

Post-Processing and Output:

A cross-section was defined to monitor simulation results using two contours:

  • Contour 1: Temperature
  • Filled, Node Values, Boundary Values, Global Range
  • Variable: Static Temperature
  • Range: 76 K – 296 K
  • Contour 2: Liquid Fraction
  • Filled, Node Values, Global Range
  • Variable: Solidification/Melting – Liquid Fraction
  • Range: 0 – 1

Results were recorded as HSF animations every 100 time steps. Every 1000 frames from these animations were exported as JPEG images

File Structure and Content:

Simulation results are organized in folders corresponding to inclination angles and ambient temperature conditions:

Data catalog: 0_22_80

  • Inclination angle: 0° (horizontal insert)
  • Ambient temperature: –22 °C
  • Initial insert temperature: –80 °C

Contents:

  • liquid/ – sequence of images showing the phase change (solidification) of the insert over time
  • temp/ – sequence of images showing the temperature distribution over time

Data catalog: 15_22_80

  • Inclination angle: 15°
  • Ambient temperature: –22 °C
  • Initial insert temperature: –80 °C

Contents:

  • liquid/ – solidification simulation frames
  • temp/ – temperature evolution frames


Data catalog: 15_80 _80

  • Inclination angle: 15°
  • Ambient temperature: –80 °C
  • Initial insert temperature: –80 °C

Contents:

  • liquid/ – solidification simulation frames
  • temp/ – temperature evolution frames

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